We Work
To Understand
Your Project Goals and Outputs
To Understand
Your Project Goals and Outputs
Precision Microchannel Liquid Cooling Plate Manufacturer: Full-Process Capability from Prototype to Volume Production
Equipped with full in‑house capabilities spanning microchannel fabrication, vacuum brazing, and thermal testing — covering the complete workflow from cold plate fabrication to performance validation. Designed to handle thermal loads of 1,000–2,500 W per cold plate for high‑power AI chips and computing modules. Available in aluminum and copper configurations. Prototype turnaround in 10 days, with scalable volume production ramp‑up. Full process control and traceability across all manufacturing parameters, backed by thermal resistance and helium leak test data — accelerating qualification cycles and minimizing integration risk.
Cross-Platform Compatibility: Process-Driven Thermal Solutions for Diverse AI Compute
From precision forming to joining and sealing, and thermal qualification—our integrated manufacturing capabilities adapt seamlessly to heterogeneous AI cooling architectures. We support high-power-density GPUs, non‑standard AI accelerators, and modular cloud ASICs. Complex flow geometries, multi‑interface compatibility, and volume production of aluminum and copper cold plates—all backed by in‑house R&D capabilities in advanced composite materials.
Walmate AI and supercomputing
liquid cooling solutions
liquid cooling solutions
High-Power Cold Plate Prototyping Experience
Delivered cold plate prototypes for 1000W–2500W AI chips in collaboration with industry-leading customers. Proficient in the complete process from blueprint to prototype delivery, ensuring seamless project execution and on-time delivery.
Aluminum & Copper Solutions Portfolio
Standard aluminum-based solutions—lightweight and cost-optimized—for mainstream thermal requirements, plus copper-based high-performance options with ultra-low thermal resistance for demanding power densities. Configurable to match diverse thermal architectures.
Comprehensive Thermal & Leak-Test Documentation
At the prototype stage, we deliver complete test reports covering thermal resistance validation and helium mass spectrometry leak detection. Fully reproducible data and audit-ready technical documentation for SQE review.
Rapid Design-Change Feasibility Assessment
Cold plate flow channels evolve with each chip iteration. Upon receiving engineering changes, we rapidly evaluate process feasibility and adjust processing plans—shortening prototype lead times without compromising quality.
Process Parameter Database & Traceability
Critical process parameters are systematically captured during prototype validation to establish fully traceable technical archives. This data repository directly informs mass production process windows, eliminating redundant verification and accelerating production ramp-up.
Working Principle
of Liquid Cooled Server
of Liquid Cooled Server
Cold Plate Liquid Cooling: The Mainstream Solution
Microchannel Liquid Cooling Plate solutions with a thermal capacity of 1000W–2500W for AI chip cooling. One-stop solution capabilities spanning microchannel machining, vacuum brazing, and thermal validation. Proven track record of prototype validation with industry-leading customers.
Immersion & Phase-Change: The Next Frontier
Immersion cooling achieves PUE below 1.08; phase-change cooling delivers enhanced heat dissipation for localized hotspots. Active R&D in fluorinated-fluid-compatible coating materials and chamber architecture.Open to joint pre‑development programs with customers, sharing development costs.
Products and Services
Heatsinks
Microchannel
value-added services
Application Cases and
Success Stories
Success Stories
